JPS5125965A - - Google Patents

Info

Publication number
JPS5125965A
JPS5125965A JP49098721A JP9872174A JPS5125965A JP S5125965 A JPS5125965 A JP S5125965A JP 49098721 A JP49098721 A JP 49098721A JP 9872174 A JP9872174 A JP 9872174A JP S5125965 A JPS5125965 A JP S5125965A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP49098721A
Other languages
Japanese (ja)
Other versions
JPS5750069B2 (en]
Inventor
Susumu Sato
Masao Hino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP49098721A priority Critical patent/JPS5750069B2/ja
Publication of JPS5125965A publication Critical patent/JPS5125965A/ja
Publication of JPS5750069B2 publication Critical patent/JPS5750069B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
JP49098721A 1974-08-27 1974-08-27 Expired JPS5750069B2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49098721A JPS5750069B2 (en]) 1974-08-27 1974-08-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49098721A JPS5750069B2 (en]) 1974-08-27 1974-08-27

Publications (2)

Publication Number Publication Date
JPS5125965A true JPS5125965A (en]) 1976-03-03
JPS5750069B2 JPS5750069B2 (en]) 1982-10-25

Family

ID=14227371

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49098721A Expired JPS5750069B2 (en]) 1974-08-27 1974-08-27

Country Status (1)

Country Link
JP (1) JPS5750069B2 (en])

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02102553A (ja) * 1988-10-12 1990-04-16 Nec Corp 集積回路装置
JPH03142943A (ja) * 1989-08-15 1991-06-18 Texas Instr Inc <Ti> 半導体装置とプリント配線板構造の組合せ
JPH0455569U (en]) * 1990-09-17 1992-05-13
JPH0455568U (en]) * 1990-09-17 1992-05-13

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4834672A (en]) * 1971-09-07 1973-05-21

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4834672A (en]) * 1971-09-07 1973-05-21

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02102553A (ja) * 1988-10-12 1990-04-16 Nec Corp 集積回路装置
JPH03142943A (ja) * 1989-08-15 1991-06-18 Texas Instr Inc <Ti> 半導体装置とプリント配線板構造の組合せ
JPH0455569U (en]) * 1990-09-17 1992-05-13
JPH0455568U (en]) * 1990-09-17 1992-05-13

Also Published As

Publication number Publication date
JPS5750069B2 (en]) 1982-10-25

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